Explanation of the use skills and methods of the h

2022-08-08
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Explanation of the use skills and methods of the hot air gun

(I) when blowing the power amplifier with plastic shell, you often blow the plastic shell of the power amplifier out of shape or burn out. I use the hot air gun 850 as an example. When blowing the power amplifier with plastic shell, such as 5110, adjust the temperature of the hot air gun to 5.5, and the scale air volume of the hot air gun to 6 The actual temperature is 270 ℃ -280 ℃ (according to your own hot air gun). The height between the nozzle of the air gun and the power amplifier is about 8cm. You can control it by yourself. Blow the four sides of the power amplifier (because the metal conducts heat quickly and the tin melts quickly). The heat soon enters the lower part of the power amplifier. In this way, the power amplifier is intact, In welding new Kung Fu, first use the air gun to add to the main board, which brings confidence to the extruder enterprise. When the tin under the main board is heated to melt, put the power amplifier on the four sides of the blowing Kung Fu, and it's OK! You can do it. It's very simple that you don't pay attention when using the air gun

(II) when going to the CPU, remove the grab nozzle of the air gun, adjust the temperature of the hot air gun to 6, adjust the scale air volume of the hot air gun to the actual temperature of 280 degrees -290 degrees, and the height of the air gun nozzle from the CPU is about 8cm. For example, for the 3508 CPU, the air gun blows the hot air into the CPU as far as possible at the four sides of the CPU, so that it is easy to blow the CPU down intact! How do you go to CPU? Is that the same

(III) mainboard disconnection and point drop are mostly caused by improper operation. Do you know why? I tell you, especially the CPU with glue is most likely to cause disconnection and point drop under the motherboard due to improper operation. My own experience of CPU with glue is introduced to you. The temperature of the hot air gun is adjusted to 5.5, and the scale air volume of the hot air gun is adjusted to 6 The actual temperature is 270-280 degrees. Blow it straight up and down on the CPU. Everyone knows that the sealing glue of the CPU is usually soft after being heated. For example, the sealing glue of Samsung Philips in 998 is soft after being heated. First, heat and clean the glue around the CPU, and then move the CPU. When heating the CPU, heat it evenly so that when all the tin under the CPU melts, it starts the CPU, so that there will be no broken wires and falling points, Do you want to put the sealing tape on the motherboard or on the CPU? You can do it by yourself. Use a flat shovel driver to do it by yourself, that is, use the steel plate of tin plate as the material. Cut 2cm wide and grind it into an image blade. Clamp it with a special tool. When you melt the tin on the lower side of the CPU, insert your own tool under the CPU. If you want to put the sealing tape on the CPU, insert the tool along the motherboard, If you want to put the sealing tape on the motherboard, you can just insert the tool under the CPU. Do you know why there are wire breaks and falling points? It is because you are not heating evenly. Most of the market prices rise temporarily in a short time. The tin under the CPU has melted, and a small part of the tin has not completely melted, We all pay attention to why there are many broken wires and points on a small piece of the motherboard, and there are no broken wires and points on other large pieces of the motherboard. This is caused by your failure to heat the CPU evenly when using the air gun! Haha, I know why

(IV) go or weld the plastic cable seat or keyboard seat, just like some array bells and power amplifiers, and master the heat and air volume of the hot air gun! Try it yourself

(V) why do short circuits sometimes occur when blowing and welding CPUs? When replacing CPUs or other BGA ICs, my own experience is that when blowing and welding CPUs or other BGA ICs, I mainly clean the IC position of the main board BGA, clean the underside of the main board, and clean the IC coated with flux. The most important thing is to pay attention to the accurate position of the IC on the main board, When blowing tin is not allowed in the IC position of the blow welding CPU or other BGA, the value of the universal experimental machine is the pointer reading IC, which will automatically locate. You don't know whether it is misplaced, so you should pay attention to the accurate position of the IC in the motherboard. Use the hot air gun, and the air volume should be small. The temperature should be set by yourself. In the blow welding IC, you should pay attention to whether the tin ball you make tin is large or small, When the tin ball is large, it is necessary to pay attention to the smaller activity range of the IC, so it is not easy for the tin balls under the IC to roll together and cause a short circuit. It is OK for the tin ball of the IC to be small and have a larger activity range. I don't know if you pay attention to this

(VI) do you know why the CPU success rate on blow welding is so low when you connect the mainboard with broken wires or points? I don't think you have found the reason. I'll find the reason for you. Everyone knows that the M series is 9988088. The broken wires and points below the CPU are more difficult to repair. My own experience is introduced. I think everyone has no problem with wiring, but do you know that the key is not in wiring, but in welding, You are well connected, and the success rate is low if the welding is not good. Some people often use some glue in the wiring, such as green oil, heat-resistant glue, 101502 and so on. It is also a good way to fix him with these glue, but so your technology is up to now, and there is no idea to improve it. Haha, look at my move. Don't you know if you use it, No matter how many wires are broken and how many points are dropped, even the external flying wires can be fixed at once. Pay attention to this point. Why are the wires broken and short points under the 8088 main board CPU2? According to the usage of the machine and the service life of the oil, the CPU success rate is relatively high on the blow welding? Why are the wires broken and short points under the 998 main board CPU position, the CPU success rate is relatively low on the blow welding? I think you must know, Because the 8088 motherboard has an obvious position of the CPU white line box, it's easy, but 998 is not easy, because it doesn't have the mark of the CPU position. How to achieve the best welding position? Everyone doesn't pay attention to this point. Everyone knows the approximate position to blow weld the CPU. You need to know that there are a connecting line and a repair welding point under the CPU. The line you connect will be separated with a little movement, so the position is the main! I connected 34 wires at most, and 7 points were fixed without glue for 2 hours. I tell you my experience. Those who lost points first dug out points and filled them with tin paste. The wiring scraped the insulating paint 1.5cm long at the place where the wire was broken. The wire I used was the thinnest enameled wire, and the tin paste was added in the point kiln where the wire was broken. Then I connected it and began to weld the CPU. The position of 8088CPU was good, but the position of 998 was not, You are on the 998 motherboard without the CPU. Look at the location of the CPU. Set the location of the CPU on the motherboard with your wire connected. The air volume of the hot air gun should be small and the temperature should be controlled by yourself. Generally, it is OK to control the temperature, Do not apply flux on the motherboard. Apply flux on the CPU (note that at the beginning of wiring, use a tin suction wire to suck the excess tin on the CPU position of the motherboard. In this way, there will be no unevenness. The positioning will be fine). Do not use anything to help the CPU not to move during welding. When welding, the tin under the CPU melts, and there is a little movement or immobility, If the CPU is a little tiny, you can see that the success rate is small

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